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Si860x
6. Ordering Guide
Table 18. Ordering Guide 1,2,3
Ordering Part
Number (OPN)
Number of
Bidirectional
Max I 2 C Bus
Speed (MHz)
Number of
Unidirectional
Max Data Rate Isolation
of Ratings
Temp
Range ( ? C)
Package
I 2 C Channels
Non-I 2 C
Channels
Non-I 2 C
Unidirectional
(kVrms)
Channels
(Mbps)
Si8600AB-B-IS
Si8600AC-B-IS
Si8600AD-B-IS
Si8602AB-B-IS
Si8602AC-B-IS
Si8602AD-B-IS
Si8605AB-B-IS1
2
2
2
1
1
1
2
1.7
1.7
1.7
1.7
1.7
1.7
1.7
0
0
0
1
1
1
1 Forward
—
—
—
10
10
10
10
2.5
3.75
5.0
2.5
3.75
5.0
2.5
–40 to 125
–40 to 125
–40 to 125
–40 to 125
–40 to 125
–40 to 125
–40 to 125
NB SOIC-8
NB SOIC-8
WB SOIC-16
NB SOIC-8
NB SOIC-8
WB SOIC-16
NB SOIC-16
1 Reverse
Si8605AC-B-IS1
2
1.7
1 Forward
10
3.75
–40 to 125
NB SOIC-16
1 Reverse
Si8605AD-B-IS
2
1.7
1 Forward
10
5.0
–40 to 125
WB SOIC-16
1 Reverse
Si8606AC-B-IS1
Si8606AD-B-IS
2
2
1.7
1.7
2 Forward
2 Forward
10
10
3.75
5.0
–40 to 125
–40 to 125
NB SOIC-16
WB SOIC-16
Notes:
1. All packages are RoHS-compliant with peak reflow temperature of 260 °C according to the JEDEC industry standard
classifications and peak solder temperature.
Moisture sensitivity level is MSL3 for wide-body SOIC-16 packages.
Moisture sensitivity level is MSL2A for narrow-body SOIC-16 packages.
Moisture sensitivity level is MSL2A for narrow-body SOIC-8 packages.
2. All devices >1 kV RMS are AEC-Q100 qualified.
3. “Si” and “SI” are used interchangeably.
Rev. 1.3
27
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